Curable polyorganosiloxane composition

ABSTRACT

Provided is a curable polyorganosiloxane composition which advantageously forms a cured product suitable for LED or optical lens, wherein the cured product has excellent light transmission properties in a short wavelength region, i.e., in the blue to ultraviolet region and is unlikely to suffer yellowing due to exposure to heat. 
     A curable polyorganosiloxane composition comprising: (A) alkenyl group-containing polyorganosiloxane which comprises (A1) branched polyorganosiloxane comprising an SiO 4/2  unit and an R 3 SiO 1/2  unit, and optionally an R 2 SiO unit and/or an RSiO 3/2  unit (wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group), wherein at least three R per molecule are alkenyl groups, and optionally (A2) linear polyorganosiloxane having R bonded to a silicon atom (wherein R is as defined above), wherein at least two R per molecule are alkenyl groups, wherein 90 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) polyalkylhydrogensiloxane comprising an SiO 4/2  unit and an R 3 (CH 3 ) 2 SiO 1/2  unit (wherein each R 3  independently represents a hydrogen atom or a methyl group), wherein at least three R 3  per molecule are hydrogen atoms; and (C) a platinum group metal compound.

FIELD OF THE INVENTION

The present invention relates to a polyorganosiloxane composition whichis curable by an addition reaction. More particularly, the presentinvention relates to a polyorganosiloxane composition which is cured toform a cured product advantageously used in optical applications such asa sealing material for light emitting diode (hereinafter, referred to as“LED”) and a lens. In addition, the present invention also relates to acured product obtained by curing the polyorganosiloxane composition,particularly a cured product advantageously used for optical lens orLED.

BACKGROUND ART

From silicone resins and silicone rubbers, including polymers exhibitingphysical properties between those of the silicone resin and rubber,there can be obtained products which are advantageous not only in thatthey have a heat resistance, a low-temperature resistance, electricalinsulation properties and others, but also in that they are transparent.Therefore, the silicone resins and silicone rubbers are used in variousoptical applications. Particularly, in the applications of sealing orprotection of LED and lens, a polyorganosiloxane composition which iscured to form a transparent cured product having high hardness isuseful.

Patent document 1 discloses that a resin-form cured product, which isobtained by crosslinking branched polyorganosiloxane having an alkenylgroup bonded to a silicon atom, particularly the polysiloxane having aphenyl group for achieving high refractive index, withpolyorganohydrogensiloxane, is used in protection, bonding, orwavelength changing or controlling of LED, and lens. However, there is aproblem in that, when the phenyl group content of the polyorganosiloxaneis high, the resultant resin-form cured product has poor lighttransmission properties in a short wavelength region, i.e., in the blueto ultraviolet region. Further, the cured product has a drawback in thatit suffers yellowing when exposed to heat. In recent years, in the fieldof LED, the luminance is improved, and the heat release increases as theluminance is increased. Hence, this problem must be solved as soon aspossible.

On the other hand, as a technique approaching the same task, which isdifferent from introducing a phenyl group into polyorganosiloxane,patent document 2 discloses a resin-form cured product obtained bycrosslinking polyorganosiloxane with polyorganohydrogensiloxane, whereinthe polyorganosiloxane has a hydroxyl group or alkoxy group bonded to asilicon atom and has monovalent hydrocarbon groups bonded to a siliconatom wherein 80% or more of the monovalent hydrocarbon groups, excludingalkenyl groups, are methyl groups. However, there is a problem in thathydrolysis or polycondensation proceeds in the resultant resin-formcured product due to the remaining hydroxyl group or alkoxy group tocause a change with the lapse of time in hardness and others, so thatthe cured product becomes brittle.

Patent document 1: Japanese Unexamined Patent Publication No.2004-186168Patent document 2: Japanese Unexamined Patent Publication No.2004-221308

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

An object of the present invention is to provide a curablepolyorganosiloxane composition which advantageously forms a curedproduct suitable for LED or optical lens wherein the cured product hasexcellent light transmission properties in a short wavelength region,i.e., in the blue to ultraviolet region and is unlikely to sufferyellowing due to exposure to heat. Another object of the presentinvention is to provide a cured product which has the above excellentproperties and is advantageously used as a sealing material for LED oran optical lens.

Means to Solve the Problems

The present inventors have made extensive and intensive studies with aview toward solving the above problems. As a result, it has been foundthat, when a composition using branched, alkenyl group-containingpolyorganosiloxane containing a large amount of methyl groups as a basepolymer and branched polyorganohydrogensiloxane as a crosslinking agentis cured by an addition reaction, the above object can be achieved, andthe present invention has been completed.

Specifically, the present invention is directed to a curablepolyorganosiloxane composition comprising:

(A) alkenyl group-containing polyorganosiloxane which comprises (A1)branched polyorganosiloxane comprising an SiO_(4/2) unit and anR₃SiO_(1/2) unit, and optionally an R₂SiO unit and/or an RSiO_(3/2) unit(wherein each R independently represents an unsubstituted or substitutedmonovalent hydrocarbon group), wherein at least three R per molecule arealkenyl groups, and optionally

(A2) linear polyorganosiloxane having R bonded to a silicon atom(wherein R is as defined above), wherein at least two R per molecule arealkenyl groups,

wherein 90 mol % or more of the R present in components (A1) and (A2),excluding alkenyl groups, are methyl groups;

(B) polyalkylhydrogensiloxane comprising an SiO_(4/2) unit and anR³(CH₃)₂SiO_(1/2) unit (wherein each R³ independently represents ahydrogen atom or a methyl group), wherein at least three R³ per moleculeare hydrogen atoms; and

(C) a platinum group metal compound.

Further, the present invention is directed to a transparent curedproduct obtained by curing the curable polyorganosiloxane composition,which is advantageously used as a sealing material for LED or an opticallens.

EFFECT OF THE INVENTION

The curable polyorganosiloxane composition of the present invention canprovide a cured product advantageously used as a sealing material forLED or an optical lens, which has excellent light transmissionproperties in a short wavelength region, i.e., in the blue toultraviolet region and is unlikely to suffer yellowing due to exposureto heat.

BEST MODE FOR CARRYING OUT THE INVENTION

The curable polyorganosiloxane composition of the present inventioncomprises (A) a base polymer, (B) a crosslinking agent, and (C) a curingcatalyst, and is cured by an addition reaction (hydrosilylationreaction) between an alkenyl group in component (A) and asilicon-hydrogen bond in component (B) to form a cured product.

In the composition of the present invention, as component (A), (A1)branched polyorganosiloxane and optionally (A2) linearpolyorganosiloxane are used.

By using component (A1) as component (A), excellent mechanical strengthcan be imparted to the cured composition. Component (A1) is branchedpolyorganosiloxane comprising an SiO_(4/2) unit and an R₃SiO_(1/2) unit,and optionally an R₂SiO unit and/or an RSiO_(3/2) unit (wherein each Rindependently represents an unsubstituted or substituted monovalenthydrocarbon group), wherein at least three R per molecule are alkenylgroups so that the polyorganosiloxane particularly serves as acrosslinking point in the curing reaction. For obtaining the curedcomposition having excellent mechanical strength, the branchedpolyorganosiloxane is preferably in a resin form in the solid state orviscous semisolid state or in a liquid form at room temperature and hasan molar ratio of R₃SiO_(1/2) unit:SiO_(4/2) unit in the range of from1:0.8 to 1:3.

Examples of the R as alkenyl groups include vinyl, allyl, 3-butenyl and5-hexenyl. The most preferred is a vinyl group from the viewpoint ofeasy to synthesis, and maintaining excellent flowability of the uncuredcomposition and excellent heat resistance of the cured composition.

The alkenyl group can be present in the R₃SiO_(1/2) unit as R. Thealkenyl group is optionally present in the R₂SiO unit or RSiO_(3/2) unitas R. For achieving rapid curing at room temperature, it is preferredthat at least part of the alkenyl group is present in the R₃SiO_(1/2)unit.

Examples of the R, excluding alkenyl groups, include unsubstituted orsubstituted monovalent hydrocarbon groups containing no aliphaticunsaturated carbon-carbon bond, for example, alkyl groups such asmethyl, ethyl, propyl, butyl, pentyl, hexyl, octyl, decyl and dodecyl;cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl;aralkyl groups such as 2-phenylethyl and 2-phenylpropyl; and halogen- orcyano-substituted monovalent hydrocarbon groups such as chloromethyl,chlorophenyl, 2-cyanoethyl and 3,3,3-trifluoropropyl. From the viewpointof obtaining excellent heat resistance, preferred is a methyl group.

In the present invention, component (A1) containing substantially nohydroxyl group or alkoxy group bonded to a silicon atom, which isderived from the raw materials and others, may be obtained by conductingthe co-hydrolysis and polycondensation conducted by a generalpreparation method, followed by treating the resultant product using anaqueous solution of an alkaline substance (for example, sodium hydroxideor potassium hydroxide) and then neutralizing the product by a generalmethod, or followed by removing moisture and then treating it withhexamethyldisilazane or 1,3-divinyl-1,1,3,3-tetramethyldisilazane.

In the present invention, it is preferred that component (A2) is used,together with component (A1), as a base polymer for the composition ofthe present invention. Component (A2) is linear polyorganosiloxanehaving R independently bonded to a silicon atom (wherein R is as definedabove), wherein at least two R per molecule are alkenyl groups.Component (A2) may be substantially linear, and may contain a branchedchain in a slight amount.

Component (A2) containing substantially no hydroxyl group or alkoxygroup bonded to a silicon atom may be obtained by introducing as an endgroup an R₃SiO_(1/2) group (for example, a dimethylvinylsiloxy group ora trimethylsilyl group), or by an alkaline treatment or a silylationtreatment in a similar manner for component (A1).

Examples and preferred examples of R for component (A2) are the same asthose for component (A1). R as an alkenyl group may be present at theend of the molecular chain of component (A2) or in the molecular chain,or present in the both. For obtaining the cured composition havingexcellent mechanical properties, it is preferred that R is present atleast at the both ends of the molecular chain.

With respect to the viscosity of component (A2), for achieving thecomposition in the uncured state having excellent flowability andexcellent workability and the cured composition having excellentmechanical strength and appropriate elasticity and hardness, theviscosity at 23° C. is preferably 0.01 to 1,000 Pa·s, more preferably0.1 to 100 Pa·s.

Representative example of component (A2) is linear polyorganosiloxanehaving in its molecule at least two alkenyl group-containing siloxaneunits each represented by the following general formula (II):

(R¹)_(a)(R²)_(b)SiO_((4a-b)/2)  (II)

-   -   wherein:    -   R¹ represents an alkenyl group;    -   R² represents an unsubstituted or substituted monovalent        hydrocarbon group containing no aliphatic unsaturated        carbon-carbon bond;    -   a is 1 or 2, preferably 1; and    -   b is an integer of 0 to 2, with the proviso that a+b is 2 or 3.

Examples and preferred examples of R¹ are the same as those of the aboveR as an alkenyl group for component (A1), and examples and preferredexamples of R² are the same as those of the above R for component (A),excluding alkenyl groups.

In the composition of the present invention, component (A1) andoptionally component (A2) are used as component (A). With respect tocomponent (A), 90 mol % or more, preferably 95 mol % or more, morepreferably 100 mol % of the R present in component (A), excludingalkenyl groups, are methyl groups. When the number of methyl groupsfalls in this range, the cured product obtained from the composition canbe improved in light transmission properties in a short wavelengthregion, i.e., in the blue to ultraviolet region, and is unlikely tosuffer yellowing due to exposure to heat.

Advantageously 90 mol % or more, preferably 95 mol % or more, morepreferably 100 mol % of the R present in component (A1), excludingalkenyl groups, are methyl groups. When using component (A2), 90 mol %or more, preferably 95 mol % or more, more preferably 100 mol % of the Rpresent in component (A2), excluding alkenyl groups, are methyl groups.

With respect to the amounts of components (A1) and (A2) in component(A), it is preferred that the amount of component (A1) is 50 to 100% byweight and the amount of component (A2) is 50 to 0% by weight, relativeto 100% by weight of component (A). When the amounts of the individualcomponents are in these ranges, component (A) is compatible withcomponent (B) and hence a homogenous composition can be formed, andfurther excellent mechanical properties, particularly hardness neededfor the cured product for LED or lens and low coefficient of linearexpansion can be imparted to a cured product. It is more preferred thatthe amount of component (A1) is 60 to 100% by weight and the amount ofcomponent (A2) is 0 to 40% by weight.

Component (B) is polyorganohydrogensiloxane having an Si—H bond in itsmolecule, and serves as a crosslinking agent which undergoes ahydrosilylation reaction between the Si—H bond and an alkenyl group inbase polymer (A) to form a cured product. As component (B), branchedpolymethylhydrogensiloxane comprising an SiO_(4/2) unit and anR³(CH₃)₂SiO_(1/2) unit (wherein R³ is as defined above) is selectedsince it is compatible with component (A) and hence a homogenouscomposition can be formed, and further high crosslinking density can beimparted to a cured product and therefore high hardness is imparted to acured product. From the viewpoint of achieving the above point whilemaintaining workable and appropriate viscosity, with respect to theratio of the R³(CH₃)₂SiO_(1/2) unit to the SiO_(4/2) unit, theR³(CH₃)₂SiO_(1/2) unit is preferably 1.5 to 2.2 mol, further preferably1.8 to 2.1 mol, relative to 1 mol of the SiO₂ unit. For obtainingcomponent (B) containing in its molecule substantially no hydroxyl groupor alkoxy group bonded to a silicon atom, which is derived from the rawmaterials and others, the R³(CH₃)₂SiO_(1/2) unit is preferably 1.9 to2.2 mol, more preferably 2.0 to 2.1 mol. Typically, especially preferredis [R³(CH₃)₂SiO_(1/2)]₈[SiO_(4/2)]₄ or [R³(CH₃)₂SiO_(1/2)]₁₀[SiO_(4/2)]₅such that four to five Q units form a cyclic or chain siloxane skeletonwherein two (In case of the chain siloxane skeleton, three at the end Qunit) M^(H) units and/or M units are bonded to each Q unit (with theproviso that one molecule has at least three M^(H) units).

The number of the hydrogen atoms directly bonded to a silicon atom in R³of component (B) is three or more per molecule in average with respectto the whole of component (B). When the number is less than three inaverage, a satisfactory crosslinking density for obtaining a curedproduct having hardness required cannot be obtained. The rest of R³ aremethyl groups for facilitating the synthesis and achieving good balancebetween the advantageous features of siloxane including heat resistance.

Component (B) is contained in an amount that the ratio of the number ofthe hydrogen atoms bonded to a silicon atom to one alkenyl group presentin component (A)(H/Vi) is 0.5 to 2.0, preferably 0.7 to 1.8. When H/Viis less than 0.5, a cured product having satisfactory physicalproperties cannot be obtained. On the other hand, when H/Vi is more than2.0, a large amount of Si—H bonds remain in the cured product and causea polycondensation reaction due to heating, so that the resultant curedproduct is brittle and cracks are easily formed in the cured productduring the heat history, and the cured product is very likely to sufferyellowing and is reduced in heat resistance and thermal shockresistance.

Platinum catalyst (C) used in the present invention is a catalyst forenhancing an addition reaction between an alkenyl group in component (A)and a hydrosilyl group in component (B). As a platinum group metalcompound, there is used a compound of a platinum group metal atom suchas platinum, rhodium or palladium, and examples include platinumcompounds such as platinate chloride, a reaction product of platinatechloride and an alcohol, a platinum-olefin complex, aplatinum-vinylsiloxane complex, a platinum-ketone complex and aplatinum-phosphine complex; rhodium compounds such as arhodium-phosphine complex and a rhodium-sulfide complex; and palladiumcompounds such as a palladium-phosphine complex. Of these, from theviewpoint of achieving excellent dissolution in component (A) andexcellent catalytic activity, preferred is a platinum-vinylsiloxanecomplex.

For obtaining excellent curing rate, component (C) is containedgenerally in an amount of 0.1 to 1,000 ppm by weight, preferably 0.5 to200 ppm by weight, in terms of a platinum group metal atom, relative tothe weight of component (A).

In the composition of the present invention, for imparting appropriateflowability to the uncured composition and imparting to the curedproduct high mechanical strength required according to the application,powdered inorganic filler can be added in such an amount that excellentfeatures of the cured product including transparency are not sacrificed.Examples of inorganic filler include dry powdered silica such as fumedsilica and arc silica, and preferred is fumed silica. For improving thetransparency, it is preferred that the silica used as filler has asurface treated with a silazane compound such as hexamethyldisilazane or1,3-divinyl-1,1,3,3-tetramethyldisilazane; or polyorganosiloxane such asoctamethylcyclotetrasiloxane. With respect to the amount of the filleradded, there is no particular limitation as long as the effect of thecomposition of the present invention can be obtained.

In the composition of the present invention, if necessary, an additive,for example, a curing retarder such as an acetylene compound (e.g.,3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-olor 1-ethynyl-1-cyclohexanol) or a vinyl group-containing cyclic siloxanehaving a vinyl group bonded to a silicon atom (e.g.,1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane); or acolorless heat-resistance improving agent such as a cerium compound(e.g., cerium octanoate), may be incorporated in an amount that theeffect aimed at by the present invention including high hardness andtransparency of the cured product is not sacrificed. According to theuse, the composition of the present invention may be dissolved ordispersed in an organic solvent such as toluene or xylene.

The composition of the present invention can be prepared by uniformlykneading components (A) to (C) and an optional component by a mixingmeans such as a universal kneader or a kneader. With respect tocomponent (A1) which is in the solid state or has extremely highviscosity, for improving the handling properties, component (A) can beformed by conducting the co-hydrolysis in an organic solvent such astoluene or xylene, and performing the subsequent steps in the form of anorganic solvent solution, and optionally mixing component (A2), and thendistilling off the solvent by heating under a reduced pressure. Forstably storing the components for a long term, components (B) and (C)are individually stored in separate containers. For example, a mainmaterial portion comprising part of component (A) and component (C) anda curing agent portion comprising the rest of component (A) andcomponent (B) are individually stored in separate containers, and theycan be mixed together immediately before being used and deaerated undera reduced pressure.

A cured product may be obtained by combining the polyorganosiloxanecomposition of the present invention together with an object such as anLED, by injecting, dropping, flow-casting, casting or extruding from acontainer the composition to a site to be used, or by monolithic moldingsuch as transfer molding or injection molding, and curing thecomposition by allowing it to stand at room temperature or heating.

The cured product obtained by curing the composition of the presentinvention has excellent light transmission properties in a shortwavelength region, i.e., in the blue to ultraviolet region such that acured product having a thickness of 2 mm generally has a lighttransmittance at a wavelength of 400 nm of 80% or more, more preferably85% or more. The cured product generally has a light transmittance at awavelength of 350 nm of 75% or more, preferably 80% or more. Further,the cured product is unlikely to suffer yellowing due to exposure toheat, and hence is unlikely to be lowered in transmittance.

The cured product obtained by curing the composition of the presentinvention generally has a refractive index of 1.40 to 1.43, preferably1.41 to 1.42.

With respect to the cured product obtained by curing the composition ofthe present invention, the ratio of a Young's modulus measured by anautograph at 150° C. to a Young's modulus measured at 23° C. isgenerally ⅓ or more, and thus the cured product can be prevented fromchanging in hardness due to exposure to heat.

The cured product obtained by curing the composition of the presentinvention generally has a hardness of 60 or more, as measured by a typeA durometer in accordance with JIS K6253. The cured product generallyhas a hardness of 20 or more, further preferably 40 or more, as measuredby a type D durometer. Therefore, the cured product has excellentmechanical strength such that the surface of the cured product isunlikely to suffer damages, and further contaminants and others areunlikely to adhere to the surface.

The curable composition of the present invention can be used in sealingfor LED. For example, the curable composition is introduced to asubstrate having an LED mounted thereon by a casting method or the likeso that the composition seals the LED and no air bubbles remain in thecomposition, and the composition is cured to prepare a shaped article oflens containing an LED therein. Alternatively, a lens shaped by acertain method is set in a part for LED, and an LED can be put in orfixed to it with an adhesive. Thus, the cured product obtained from thecurable composition of the present invention is preferably used as asealing material for LED or an optical lens.

EXAMPLES

Hereinbelow, the present invention will be described in more detail withreference to the following Examples and Comparative Examples. In thefollowing Examples and Comparative Examples, “part(s)” is given byweight, “%” for formulation is given by weight, and the viscosity meansa viscosity as measured at 23° C. The following Examples should not beconstrued as limiting the scope of the present invention.

In the following Examples and Comparative Examples, siloxane units aredesignated by the following symbols.

M unit: (CH₃)₃SiO_(1/2)—

M^(H) unit: (CH₃)₂HSiO_(1/2)—

M^(v) unit: (CH₃)₂(CH₂═CH)SiO_(1/2)—

D unit: —(CH₃)₂SiO—

D^(H) unit: —(CH₃)HSiO—

D^(v) unit: —(CH₃)(CH₂═CH)SiO—

D^(ff) unit: —(C₆H₅)₂SiO—

T^(f) unit: C₆H₅SiO_(3/2) (trifunctional)

Q unit: SiO_(4/2) (tetrafunctional)

The polyorganosiloxanes used in the Examples and Comparative Examplesare as follows.

a1-1: A 60% xylene solution of solid branched polymethylvinylsiloxanecomprising an M unit, an M^(v) unit and a Q unit and having a unit molarratio represented by M₅M^(v)Q8;

a1-2: Phenyl group-containing polyorganosiloxane comprising a D unit, aD^(v) unit, a D^(ff) unit and a T^(f) unit, having a unit molar ratiorepresented by DD^(v) ₁₂D^(ff) ₅₄T^(f) ₃₃, and having a viscosity of5,000 Pa·s;

a2-1: Linear polymethylvinylsiloxane comprising M^(v) units at the bothends, D^(v) units in an amount of 10 mol % of the intermediate units,and D units in the rest of them, and having a viscosity of 200 mm²/s at23° C.; and

a2-2: Linear polymethylvinylphenylsiloxane comprising M^(v) units at theboth ends, D^(v) units in an amount of 30%, D^(ff) units in an amount of30% of the intermediate units, and D units in the rest of them, andhaving a viscosity of 4,000 mm²/s at 23° C.

The above polyorganosiloxane a1-1 was prepared as follows. 210 Parts ofxylene, 271.3 parts of trimethylchlorosilane, 60.3 parts ofdimethylvinylchlorosilane and 832 parts of tetraethoxysilane were placedin a reaction vessel having a stirrer, a dripping apparatus, a heatingand cooling apparatus, and a vacuum evaporator, and the solids werecompletely dissolved. Excess water was dripped into the resultantsolution to effect co-hydrolysis and condensation at 80° C. whileremoving heat of dissolution of the by-produced hydrochloric acid bycooling. The resultant organic layer was washed with water until thewashing water became neutral, and dried and then KOH was added so thatthe concentration became 200 ppm to effect dehydration or condensationat 140° C. while removing water from the system. Then, the resultantreaction mixture was neutralized with phosphoric acid, and the saltsformed were removed by filtration, and the resultant filtrate wasdiluted with xylene so that the non-volatile content became 60%.

The above polyorganosiloxane a2-1 was prepared as follows. 765.2 Partsof octamethylcyclotetrasiloxane and 98.8 parts oftetravinyltetramethylcyclotetrasiloxane were placed in a reaction vesselhaving a stirrer, a dripping apparatus, a heating and cooling apparatus,and a vacuum evaporator, and stirred at 140° C. while introducing N₂into the reaction vessel to effect dehydration. Then, 14.2 parts of1,7-divinyl-1,1,3,3,5,5,7,7-octamethylsiloxane and 8 parts of KOH wereadded to the resultant mixture to effect ring-opening polymerization at140° C. for 8 hours. Subsequently, the resultant reaction mixture wascooled to 100° C., and 100 g of ethylene chlorohydrin was added theretoto effect neutralization at 100° C. for 2 hours. Then, lowmolecular-weight polymers were removed by stripping at 160° C. under 1.3KPa (10 mmHg) or lower for 4 hours, followed by cooling and filtration,to obtain a desired product.

Crosslinking agent b used in the Examples and Comparative Examples wasprepared as follows. 520 Parts of toluene, 879 parts oftetraethoxysilane, and 832 parts of dimethylchlorosilane were charged,and the solids were completely dissolved. The resultant solution wasdripped into excess water in a reaction vessel having a stirrer, adripping apparatus, a heating and cooling apparatus, and a vacuumevaporator while stirring to effect co-hydrolysis and condensation atroom temperature while removing heat of dissolution of the by-producedhydrochloric acid by cooling. The resultant organic phase was washedwith water until the washing water became neutral, and dried and thentoluene and by-produced tetramethyldisiloxane were distilled off at 100°C. under 667 Pa (5 mmHg) to prepare polymethylhydrogensiloxane in theliquid state. The siloxane prepared has an average molecular weight of800 (theoretical value: 776) as measured by GPC, and this molecularweight measurement and the result of an analysis of Si—H bond byalkalimetry have confirmed that the siloxane obtained ispolymethylhydrogensiloxane approximately represented by M^(H) ₈Q₄.

Curing catalyst c used in the Examples and Comparative Examples is aplatinum-vinylsiloxane complex having a platinum content of 2% byweight, which is prepared by heating platinate chloride together withcyclic siloxane represented by D^(v) ₄.

The curing retarder used in the Examples and Comparative Examples is1-ethynyl-1-cyclohexanol. The fumed silica has a specific surface areaof 300 m²/g, and has a surface treated with hexamethyldisilazane.

Examples 1 to 3 and Comparative Example 1

In Examples, a1-1 is a xylene solution and hence, a1-1 and a2-1 wereplaced in a vessel having a vacuum heating apparatus and a stirrer, andstirred and mixed together until they became homogenious, and thenxylene contained in a1-1 was distilled off at 140° C. under 667 Pa (5mmHg) to prepare a base polymer mixture in the liquid state.

A main material portion comprising part of a base polymer, a catalystand part of fumed silica, and a curing agent portion comprising the restof the base polymer, a crosslinking agent, a curing retarder and therest of the fumed silica were individually prepared using a universalkneader in the formulations shown in Table 1. The amounts of the basepolymer and fumed silica were adjusted so that the weight ratio of mainmaterial portion:curing agent portion became almost 1:1. The mainmaterial portion and the curing agent portion were mixed together anddeaerated, and casted into a sheet form having a thickness of 2 mm. Theresultant sheet was cured by heating in an oven at 150° C. for one hour,thus obtaining a colorless and transparent resin-form cured producthaving slight elongation.

A composition and a cured product obtained therefrom were evaluated asfollows.

(1) Hardness: The sheet was allowed to stand at 23° C. for 24 hours andthen, with respect to the resultant sheet, a hardness was measuredindividually by a type A durometer and a type D durometer in accordancewith JIS K6253.

(2) Light transmittance: With respect to the sheet (thickness: 2 mm), alight transmittance was measured at 23° C. individually at wavelengthsof 400 nm and 350 nm using Spectrophotometer (model U-3410, manufacturedby Hitachi, Ltd). Then, the sheet was allowed to stand at 180° C. for1,000 hours and then, with respect to the resultant sheet, a lighttransmittance was similarly measured individually at wavelengths of 400nm and 350 nm.

(3) Refractive index: With respect to the uncured composition, arefractive index was measured at 23° C. by means of Abbe refractometer(manufactured by ATAGO CO., LTD).

(4) Young's modulus: With respect to the specimen prepared from a sheethaving a thickness of 2 mm using a dumbbell No. 2 shaped die describedin JIS K6251, a tensile test was conducted using Autograph (model AG-IS,manufactured by Shimadzu Corporation) and a thermostatic chambertherefor, and a tensile strength at 2.5% elongation was determined as aYoung's modulus.

The formulations in the Examples and Comparative Examples, curingproperties of the compositions, and physical properties of the curedproducts are shown in Table 1. In the formulations, the amount of a1-1is in terms of siloxane. With respect to the composition prepared by amethod in which a main material portion and a curing agent portion areseparately prepared and then mixed together, the amounts in theformulation shown in Table 1 are the individual total amounts.

TABLE 1 Part(s) by weight Comparative Formulation Example 1 Example 2Example 3 Example 1 Base polymer a 1 - 1 38.4 35.4 35.4 a 1 - 2 58.0 a2 - 1 27.4 32.4 27.4 a 2 - 2 26.0 Crosslinking agent b 8.5 8.5 8.5 14.0Curing catalyst c 0.02 0.02 0.02 0.02 Other components Curing retarder:0.1 0.1 0.1 0.1 Fumed silica 6.5 Methyl content mol % 100 100 100 27.9(relative to the hydrocarbon groups excluding vinyl group) H/Vi* 1.030.97 1.07 1.22 Refractive index 1.41 1.42 1.42 1.53 Hardness JIS A 97 9698 99 JIS D 52 45 60 70 Transmittance Initial 400 nm [%] 90 91 89 89 350nm [%] 88 90 86 82 After heating 400 nm [%] 89 90 88 80 350 nm [%] 87 8985 47 Young's modulus  23° C. [MPa] 70 68 110 180 150° C. [MPa] 33 31 7025 Measured value at 150° C./measured value at 23° C. 0.54 0.46 0.640.14 *The number of the hydrogen atoms bonded to silicon atom present inthe crosslinking agent, relative to one vinyl group present in the basepolymer.

The composition in Comparative Example 1 used polyorganosiloxanecontaining a phenyl group, and the cured product obtained from thiscomposition had poor light transmission properties at 350 nm. Further,in the cured product obtained after the heating test, the lighttransmittances both at 400 nm and 350 nm were lowered due to yellowing,and especially the light transmittance at 350 nm was remarkably lowered.With respect to the Young's modulus, the ratio of a measured value at150° C. to a measured value at 23° C. was ⅓ or less.

In contrast, with respect to each of the compositions in Examples 1 to 3of the present invention, the cured product obtained from eachcomposition had excellent light transmittances both at 400 nm and 350nm. Further, in the cured product obtained after the heating test, thelowering of the light transmittance was suppressed. The fact that thelowering of the transmittance at 400 nm was suppressed indicates thatthe occurrence of yellowing was prevented. With respect to the Young'smodulus, the ratio of a measured value at 150° C. to a measured value at23° C. was ⅓ or more.

INDUSTRIAL APPLICABILITY

The curable polyorganosiloxane composition of the present invention canprovide a cured product having excellent light transmission propertiesin a short wavelength region, i.e., in the blue to ultraviolet regionand having excellent heat resistance, and hence is advantageously usedfor various optical lenses. Further, the present invention isadvantageously used in sealing or protection of LED, lens, and others.

1. A curable polyorganosiloxane composition comprising: (A) alkenylgroup-containing polyorganosiloxane which comprises (A1) branchedpolyorganosiloxane comprising an SiO_(4/2) unit and an R₃SiO_(1/2) unit,and optionally an R₂SiO unit and/or an RSiO_(3/2) unit (wherein each Rindependently represents an unsubstituted or substituted monovalenthydrocarbon group), wherein at least three R per molecule are alkenylgroups, and optionally (A2) linear polyorganosiloxane having R bonded toa silicon atom (wherein R is as defined above), wherein at least two Rper molecule are alkenyl groups, wherein 90 mol % or more of the Rpresent in the components (A1) and (A2), excluding alkenyl groups, aremethyl groups; (B) polyalkylhydrogensiloxane comprising an SiO_(4/2)unit and an R³(CH₃)₂SiO_(1/2) unit (wherein each R³ independentlyrepresents a hydrogen atom or a methyl group), wherein at least three R³per molecule are hydrogen atoms; and (C) a platinum group metalcompound.
 2. The polyorganosiloxane composition according to claim 1,wherein 100 mol % of the R, excluding alkenyl groups, are methyl groups.3. The polyorganosiloxane composition according to claim 1, wherein thecomponent (B) is contained in an amount that the number of the R³ as ahydrogen atom is 0.5 to 2.0, relative to one alkenyl group present inthe component (A), wherein the component (C) is contained in an amountof 0.1 to 1,000 ppm by weight in terms of a platinum group metal atom,relative to the weight of the component (A).
 4. The polyorganosiloxanecomposition according to claim 1, wherein the amount of the component(A1) is 50 to 100% by weight and the amount of the component (A2) is 50to 0% by weight, relative to 100% by weight of the component (A).
 5. Thepolyorganosiloxane composition according to claim 1, wherein the R as analkenyl group is a vinyl group.
 6. The polyorganosiloxane compositionaccording to claim 1, wherein the component (C) is aplatinum-vinylsiloxane complex.
 7. A cured product obtained by curingthe polyorganosiloxane composition according to claim
 1. 8. The curedproduct according to claim 7, which is an optical lens.
 9. The curedproduct according to claim 7, which is a sealing material for lightemitting diode.
 10. The polyorganosiloxane composition according toclaim 2, wherein the component (B) is contained in an amount that thenumber of the R³ as a hydrogen atom is 0.5 to 2.0, relative to onealkenyl group present in the component (A), wherein the component (C) iscontained in an amount of 0.1 to 1,000 ppm by weight in terms of aplatinum group metal atom, relative to the weight of the component (A).11. The polyorganosiloxane composition according to claim 2, wherein theamount of the component (A1) is 50 to 100% by weight and the amount ofthe component (A2) is 50 to 0% by weight, relative to 100% by weight ofthe component (A).
 12. The polyorganosiloxane composition according toclaim 2, wherein the R as an alkenyl group is a vinyl group.
 13. Thepolyorganosiloxane composition according to claim 2, wherein thecomponent (C) is a platinum-vinylsiloxane complex.
 14. A cured productobtained by curing the polyorganosiloxane composition according to claim2.
 15. The cured product according to claim 14, which is an opticallens.
 16. The cured product according to claim 14, which is a sealingmaterial for light emitting diode.